NDLI: Formation of bulk Ag$_{3}$Sn intermetallic compounds in Sn-Ag lead-free solders in solidification

Content Provider	Springer Nature Link
Author	Shen, J. Liu, Y. C. Gao, H. X. Wei, C. Yang, Y. Q.
Copyright Year	2005
Abstract	A series of Sn-Ag solders were prepared by arc melting and their phase evolution was investigated as a function of cooling rates. It was found that bulk Ag$_{3}$Sn intermetallic compounds (IMCs) separated out only in the slowly cooled Sn-4.0Ag solder. This would be explained by the strong kinetic undercooling, arising from the rapid cooling conditions, which leads to the actual eutectic point shifts in the direction of higher Ag concentration. Thus, the eutectic and hypereutectic alloys experience a metastable hypoeutectic solidification route instead. All formed fractions of bulk Ag$_{3}$Sn IMCs in solders, measured by quantitative microstructural analysis and thermal analysis, are larger than those predicted by the equilibrium phase diagram. The reasoning for this could be attributed to fine Ag$_{3}$Sn phases, which cling to the primary Ag$_{3}$Sn crystal during the eutectic reaction for their matching crystalline orientation relationship. Furthermore, the fraction of bulk Ag$_{3}$Sn IMCs increases gradually with increasing the cooling rate in the slowly cooled Sn-4.0Ag alloy, which fits with the prediction of eutectic solidification theory: the increase of cooling rate would decrease the surface energy of fine Ag$_{3}$Sn particles and primary Ag$_{3}$Sn crystal, and make fine Ag$_{3}$Sn particles cling to primary Ag$_{3}$Sn crystal easily to form bulk Ag$_{3}$Sn IMCs.
Starting Page	1591
Ending Page	1597
Page Count	7
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	34
Issue Number	12
e-ISSN	1543186X
Language	English
Publisher	Springer-Verlag
Publisher Date	2005-01-01
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Lead-free solder intermetallic compounds (IMCs) kinetic undercooling thermal analysis Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics and Spectroscopy
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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