NDLI: Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder

Content Provider	Springer Nature Link
Author	Yoon, Jeong Won Kim, Sang Won Koo, Ja Myeong Kim, Dae Gon Jung, Seung Boo
Copyright Year	2004
Abstract	The interfacial reactions between two Sn-Cu (Sn-0.7Cu and Sn-3Cu, wt.%) ball-grid-array (BGA) solders and the Au/Ni/Cu substrate by solid-state isothermal aging were examined at temperatures between 70°C and 170°C for 0 to 100 days. For the Sn-0.7Cu solder, a (Cu,Ni)$_{6}$Sn$_{5}$ layer was observed in the samples aged at 70–150°C. After isothermal aging at 170°C for 50 days, the solder/Ni interface exhibited a duplex structure of (Cu,Ni)$_{6}$Sn$_{5}$ and (Ni,Cu)$_{3}$Sn$_{4}$. For the Sn-3Cu solder, only the (Cu,Ni)$_{6}$Sn$_{5}$ layer was formed in all aged samples. Compared to these two Sn-Cu solders, the Cu content in the (Cu,Ni)$_{6}$Sn$_{5}$ layer formed at the interface increased with the Cu concentration in the Sn-xCu solders. And, the shear strength was measured to evaluate the effect of the interfacial reactions on the mechanical reliability as a function of aging conditions. The shear strength significantly decreased after aging for 1 day and then remained nearly unchanged by further prolonged aging. In all the samples, the fracture always occurred in the bulk solder. Also, we studied the electrical property of Cu/Sn-3Cu/Cu BGA packages with the number of reflows. The electrical resistivity increased with the number of reflows because of an increase of intermetallic compound (IMC) thickness.
Starting Page	1190
Ending Page	1199
Page Count	10
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	33
Issue Number	10
e-ISSN	1543186X
Language	English
Publisher	Springer-Verlag
Publisher Date	2004-01-01
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Sn-Cu solder interfacial reaction ball shear test intermetallic compound (IMC) isothermal aging electrical resistivity Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics and Spectroscopy
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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