NDLI: Preparation of selective conductive copper patterns by pen-on-paper writing combined with electroless plating

Content Provider	Springer Nature Link
Author	Hou, Lei Lu, Yinxiang Zhao, Hang
Copyright Year	2016
Abstract	Conductive Cu patterns were constructed on flexible paper via selectively electroless plating method, which including multistep procedures, namely, 3-aminopropyltrimethoxysilane (APTMS)-modification, selective Cu$^{0}$-seeding and Cu-lines deposition. Herein, the Cu$^{0}$ activation process could be divided into two stages: the Cu$^{2+}$-absorption in cupric citrate solution and subsequently the Cu$^{2+}$-reduction using a roller pen filled with sodium borohydride ink. The interaction of APTMS onto paper was confirmed by FT-IR measurement and the results indicated that the –NH$_{2}$ groups originating from APTMS were grafted on the paper. The elemental analysis of the samples in each step was conducted using XPS measurement. Paper-based conductive patterns were investigated by SEM, XRD and Scotch$^{®}$-tape test. SEM images illustrated that the Cu lines on the APTMS modified paper substrate was compact and composed of ball-shaped copper nuclei. Moreover, the Cu lines could be selectively plated on the required area of the paper substrate. XRD analysis showed that the obtained Cu patterns had a structure with Cu (1 1 1) preferred orientation, revealing an excellent electromigration resistivity. The resultant Cu patterns exhibited an admired adhesion to modified paper, while the Cu patterns obtained in absence of APTMS modification suffered a failure in the adhesive Scotch$^{®}$-tape test. The resistivity of copper patterns characterized by the digital four-point probe was 10.3 µΩ cm, which was 6.3 times of the bulk Cu. Meanwhile, paper-based Cu pattern remained excellent conductivity after multifolding. Those results indicated that the method proposed in the present work offered a robust and efficient alternative to manufacture flexible electronics.
Starting Page	7318
Ending Page	7326
Page Count	9
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	27
Issue Number	7
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2016-03-19
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Optical and Electronic Materials Characterization and Evaluation of Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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