NDLI: Thermal creep and fracture behaviors of the lead-free Sn–Ag–Cu–Bi solder interconnections under different stress levels

Content Provider	Springer Nature Link
Author	Zhang, X. P. Yin, L. M. Yu, C. B.
Copyright Year	2007
Abstract	In our previous study, the creep behavior of the lead-free Sn–Ag–Cu–Bi solder joints has been proven to follow the Arrhenius power-law relationship, and the thermal fatigue behavior of the solder joints exhibits the typical creep deformation characteristics with a superposition of the pulsating features. In this study, the thermal creep and fracture behaviors of the lead-free Sn–Ag–Cu–Bi solder interconnections were characterized under different stress levels, with a systematical comparison to that of a traditional Sn60Pb40 near-eutectic solder. The results show that the creep strain rate of both solder connections follows Weertman-Dorn equation, and the calculated creep stress exponent for two solders is reasonably close to other published data. The SEM inspection and analysis of fractographies of creep fractured solder joints manifest that the creep failure of the lead-free Sn–Ag–Cu–Bi solder joint shows obviously intergranular fracture mechanism, while the Sn60Pb40 joint ruptures dominantly by a transgranular sliding mechanism.
Starting Page	393
Ending Page	398
Page Count	6
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	19
Issue Number	4
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2007-06-30
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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