NDLI: High-resolution low-cost optoelectronic instrument for supervising grape must fermentation

Content Provider	Springer Nature Link
Author	Jiménez Márquez, F. Vázquez, J. Úbeda, J. Sánchez Rojas, J. L.
Copyright Year	2013
Abstract	In a globalized world, the quality–cost ratio for wine is a key factor for winemakers in order to be competitive. Therefore, the fermentation process of grape must should ideally be continuously supervised to achieve a wine that meets the expected quality standards, avoiding undesirable states which may contribute to raise the cost. However, the traditional procedure followed by winemakers to monitor the fermentation process is not automated as winemaking is monitored manually by enologists, who must extract and analyze fermenting must samples at least twice a day from each fermentation tank during the whole fermentation process. An optoelectronic device has been developed in order to contribute to the automation of the wine fermentation process. It is capable of measuring both the fermentation kinetics and the maceration of wine during the whole fermentation by means of refractometric techniques and absorbance measurements in the visible spectrum, respectively. Moreover, as the refractive index is not measured by enologists during the fermentation (they rely on density measurements instead), it has been validated as an indicator for monitoring the fermentation kinetics according to both predictions derived from analytical calculations and from experimental data obtained in several fermentations with the optoelectronic device and other analytical techniques. The system consists of a laser diode and a PSD (position sensitive detector) for refractive index measurements, LEDs and photodiodes for color measurements, and a temperature sensor useful to reference the data to 20 °C. It also comprises a frame holder, some conditioning circuits and a data acquisition board.
Starting Page	769
Ending Page	782
Page Count	14
File Format	PDF
ISSN	09467076
Journal	Microsystem Technologies
Volume Number	20
Issue Number	4-5
e-ISSN	14321858
Language	English
Publisher	Springer Berlin Heidelberg
Publisher Date	2013-12-15
Publisher Place	Berlin, Heidelberg
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Electronics and Microelectronics, Instrumentation Nanotechnology Mechanical Engineering
Content Type	Text
Resource Type	Article
Subject	Nanoscience and Nanotechnology Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering Hardware and Architecture

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Low cost packaging for gas sensors

Low cost anodic bonding for MEMS packaging applications

Low cost fabrication of microelectrodes on plastic substrate

Multi-resolution HDD contact detection technique for low SNR applications

A low-cost through via interconnection for ISM WLP

Low cost dual axis micro force sensor for robotic manipulations

Low-cost silicon wafer dicing using a craft cutter

A novel fast and low cost replication technology for high-aspect-ratio magnetic microstructures

Automated and low cost method to manufacture addressable solid-state nanopores

High-resolution low-cost optoelectronic instrument for supervising grape must fermentation

Similar Documents

Low cost packaging for gas sensors

Low cost anodic bonding for MEMS packaging applications

Low cost fabrication of microelectrodes on plastic substrate

Multi-resolution HDD contact detection technique for low SNR applications

A low-cost through via interconnection for ISM WLP

Low cost dual axis micro force sensor for robotic manipulations

Low-cost silicon wafer dicing using a craft cutter

A novel fast and low cost replication technology for high-aspect-ratio magnetic microstructures

Automated and low cost method to manufacture addressable solid-state nanopores

High-resolution low-cost optoelectronic instrument for supervising grape must fermentation