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DUAL-DIES PACKAGING STRUCTURE AND PACKAGING METHOD BACKGROUND OF THE INVENTION 1. Field of the Invention
| Content Provider | Semantic Scholar |
|---|---|
| Copyright Year | 2017 |
| Abstract | A dual-dies packaging Structure is provided. The dual-dies packaging Structure includes a lead frame, which further includes a die pad and Several lead legs, in which the die pad includes an upper Surface and a lower Surface. A first die, having Several first bonding pads, is fixed on the upper Surface of the die pad by, for example, gluing it. The first bonding pads remain exposed. A Second die, having Several Second bonding pads, is fixed on the lower Surface by, for example, gluing it. The Second bonding pads remain exposed. A bumping redistribution Structure layer is located on the Second die So as to redistribute each of the Second bonding pads to a pseudo-bonding pad. Each pseudo bonding pad has its proper location with respect to the first bonding pads. Thus, when Several bonding wires are used to bond the first bonding pads and the pseudo-bonding pads to the lead legs, bonding wires can be regularly and Simply put on without crossing or entangling to each other. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/0e/88/da/97abce7d130a9e/US6313527.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
