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Excellent Burr Property and Reliability and Semconductor Device Using the Same
| Content Provider | Semantic Scholar |
|---|---|
| Author | Park, Hyo Soon |
| Copyright Year | 2017 |
| Abstract | The present invention relates to a dicing die bonding film employed in a semiconductor packaging process, and a semiconductor device using the same. The dicing die bond ing film is configured such that a ratio X/Y of adhesive power X between the wafer and the adhesive layer of the die bonding portion to tacky power Y between the die bonding portion and the tacky layer of the dicing portion is 0.15 to 1, and the adhesive layer of the die bonding portion has a storage modulus of 100 to 1000 MPa at a normal tempera ture. The dicing die bonding film according to the present invention reduces burr generation in dicing process, and thereby preparing a semiconductor device having excellent reliability without inferiority caused by bad connection reliability due to the burr covering a bonding pad. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/3f/82/ac/3438065818a910/US9695345.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |