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PROCESS FOR REMOVING TIN AND TIN-LEAD ALLOY FROM COPPER SUBSTRATES BACKGROUND OF THE INVENTION 1. Field of the Invention
| Content Provider | Semantic Scholar |
|---|---|
| Author | Haruta, Tsunemitsu Nagano, Takaharu Yamada, Yasushi |
| Copyright Year | 2017 |
| Abstract | Disclosed is a method for removing a layer of tin or tin-lead alloy from a copper substrate of a printed cir cuit board employing the two different reagents in a two-step procedure without damaging the substrate, and at the same time, preventing formation of whitish precipitates in the treating solution. In the first step, the layer of tin or tin-lead alloy is selec tively removed with the first reagent having a compara tively mild oxidation capability, then in the second step the intermetallic layer consisting of tin and copper is removed with the second reagent having a compara tively strong oxidation capability. This process ensures a smooth and effective operation in the production of high quality printed circuit boards. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/ad/36/4f/c51807e7b80876/US5035749.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |