NDLI: AO-resistant shape memory polyimide/silica composites with excellent thermal stability and mechanical properties

Content Provider	Royal Society of Chemistry (RSC)
Author	Wang, Qihua Wang, Tingmei Yang, Zenghui Bai, Yongkang
Copyright Year	2015
Abstract	Shape memory polyimide/silica (PI/silica) composites with atomic oxygen resistance, good thermal stability and mechanical properties are synthesized by co-condensation of poly(amic acid) terminated with (3-aminopropy)triethoxysilane (APTES) and tetraethoxysliane (TEOS) via a sol–gel method. The silica networks formed in the hybrid films act not only as permanent crosslink points, but as atomic oxygen (AO) resistant moieties. The results show that the PI/silica composite films possess high thermal decomposition temperature (Td > 550 °C), high glass transition temperature (Tg > 265 °C) as well as good shape fixation ratio (Rf > 98%) and shape recovery ratio (Rr > 90%). The mechanical properties, surface topography and shape memory performance of PI/silica composite films were evaluated before and after AO irradiation in simulated space environment. Compared to pristine PI, the mechanical properties, surface topography, and shape memory performances of PI–SiO2-15 were less affected by AO exposure, which results from the silica protective layer formed on the composite film surface, indicating good AO-resistant ability of PI/silica composite films. This work may provide a strategy toward the design of promising shape memory materials for applications in the field of severe conditions.
Starting Page	72971
Ending Page	72980
Page Count	10
File Format	HTM / HTML PDF
ISSN	20462069
Volume Number	5
Issue Number	89
Journal	RSC Advances
DOI	10.1039/c5ra12293g
Language	English
Publisher	Royal Society of Chemistry
Access Restriction	Open
Subject Keyword	Glass transition Composite film Polyimide TEOS Oxygen (3-Aminopropyl)triethoxysilane Adaptive optics Silicon dioxide Shape-memory alloy
Content Type	Text
Resource Type	Article
Subject	Chemistry Chemical Engineering

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