NDLI: AO-resistant shape memory polyimide/silica composites with excellent thermal stability and mechanical properties

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AO-resistant shape memory polyimide/silica composites with excellent thermal stability and mechanical properties

Content Provider	Semantic Scholar
Author	Yang, Zenghui Wang, Qihua Bai, Yongkang Wang, Tingmei
Copyright Year	2015
Abstract	Shape memory polyimide/silica (PI/silica) composites with atomic oxygen resistance, good thermal stability and mechanical properties are synthesized by co-condensation of poly(amic acid) terminated with (3-aminopropy)triethoxysilane (APTES) and tetraethoxysliane (TEOS) via a sol–gel method. The silica networks formed in the hybrid films act not only as permanent crosslink points, but as atomic oxygen (AO) resistant moieties. The results show that the PI/silica composite films possess high thermal decomposition temperature (Td > 550 °C), high glass transition temperature (Tg > 265 °C) as well as good shape fixation ratio (Rf > 98%) and shape recovery ratio (Rr > 90%). The mechanical properties, surface topography and shape memory performance of PI/silica composite films were evaluated before and after AO irradiation in simulated space environment. Compared to pristine PI, the mechanical properties, surface topography, and shape memory performances of PI–SiO2-15 were less affected by AO exposure, which results from the silica protective layer formed on the composite film surface, indicating good AO-resistant ability of PI/silica composite films. This work may provide a strategy toward the design of promising shape memory materials for applications in the field of severe conditions.
Starting Page	72971
Ending Page	72980
Page Count	10
File Format	PDF HTM / HTML
DOI	10.1039/C5RA12293G
Alternate Webpage(s)	https://pubs.rsc.org/en/content/getauthorversionpdf/C5RA12293G
Alternate Webpage(s)	https://doi.org/10.1039/C5RA12293G
Volume Number	5
Language	English
Access Restriction	Open
Content Type	Text
Resource Type	Article

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