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| Content Provider | IET Digital Library |
|---|---|
| Author | Dong, Xiaojun Griffo, Antonio Wang, Jiabin |
| Abstract | In this study, a three-dimensional model with multi-parameter order reduction is applied to the thermal modelling of power electronics modules with complex geometries. Finite element or finite difference method can be used to establish accurate mathematical models for thermal analyses. Unfortunately, the resulting computational complexity hinders the analysis in parametric studies. This study proposes a parametric order reduction technique that can significantly increase simulation efficiency without significant penalty in the prediction accuracy. The method, based on the block Arnoldi method, is illustrated with reference to a multi-chip SiC power module mounted on a forced air-cooled finned heat sink with a variable mass flow rate. |
| Starting Page | 3603 |
| Ending Page | 3608 |
| Page Count | 6 |
| Volume Number | 2019 |
| e-ISSN | 20513305 |
| Issue Number | Issue 17, Jun (2019) |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/joe/2019/17 |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/10.1049/joe.2018.8094 |
| Journal | The Journal of Engineering |
| Publisher | The Institution of Engineering and Technology |
| Publisher Date | 2019-01-22 |
| Access Restriction | Open |
| Rights License | Creative Commons Attribution License (http://creativecommons.org/licenses/by/3.0/) |
| Subject Keyword | Accurate Mathematical Model Block Arnoldi Method Complex Geometries Computational Complexity Cooling Differential Equation (numerical Analysis) Fast Simulation Finite Difference Method Finite Element Analysis Finite Element Method Forced Air-cooled Finned Heat Sink Heat Sinks Multichip Silicon Carbide Power Module Multiparameter Model Reduction Multiparameter Order Reduction Parametric Order Reduction Technique Power Electronics Power Electronics Module Power Module Power Semiconductor Device Product Packaging Reduced Order System SiC Silicon Compound Simulation Efficiency Temperature Distribution Thermal Analysis Thermal Modelling Three-dimensional Model Transient Temperature Distribution Variable Mass Flow Rate |
| Content Type | Text |
| Resource Type | Article |
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