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| Content Provider | IET Digital Library |
|---|---|
| Author | Hao, Ronghui Wu, Dongdong Fu, Kai Song, Liang Chen, Fu Zhao, Jie Du, Zhongkai Zhang, Bingliang Wang, Qilong Yu, Guohao Cheng, Kai Cai, Yong Zhang, Xinping Zhang, Baoshun |
| Abstract | Normally off p-gallium nitride (GaN) gate high-electron-mobility transistors (HEMTs) on silicon substrate were fabricated with hydrogen plasma treatment technology, which features a high-resistivity cap layer (HRCL) at the access region. With hydrogen plasma treatment at the access region, the normally off operation was obtained with a threshold voltage of +2.5 V based on the linear extrapolation of the transfer curve. The fabricated HRCL-HEMT with a gate width of 49.7 mm exhibits a maximum drain current of 10 A at V GS = 8 V and a high off-state breakdown voltage of 567 V at V GS = 0 V with substrate grounded. Meanwhile, the HRCL-HEMT also shows low-gate leakage current of 1.3 × 10−7 and 3.3 × 10−10 A/mm at V GS = 8 V and = −30 V, respectively. The positive threshold voltage, high drain current, high-breakdown voltage and low-gate leakage show the potential of HRCL-HEMT for power switching applications. |
| Starting Page | 848 |
| Ending Page | 849 |
| Page Count | 2 |
| ISSN | 00135194 |
| Volume Number | 54 |
| e-ISSN | 1350911X |
| Issue Number | Issue 13, Jun (2018) |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/el/54/13 |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/10.1049/el.2017.3981 |
| Journal | Electronics Letters |
| Publisher Date | 2018-05-17 |
| Access Restriction | Open |
| Rights Holder | © The Institution of Engineering and Technology |
| Subject Keyword | Current 10.0 A Fabricated HRCL-HEMT Field Effect Device Gallium Compound GaN High Electron Mobility Transistors High-breakdown Voltage High-resistivity Cap Layer High-threshold Voltage Hydrogen Plasma Treatment Technology III-V SemiConductor Leakage Current Low-gate Leakage Current Nanofabrication Nanometre-Scale Semiconductor Fabrication Technology Normally off P-GaN Gate HEMT Off-state Breakdown Voltage P-gallium Nitride Gate High-electron-mobility Transistors Positive Threshold Voltage Power Switching Application Semiconductor Device Breakdown Silicon Silicon Substrate Size 49.7 Mm Voltage -30.0 V Voltage 2.5 V Voltage 567.0 V Voltage 8.0 V Wide Band Gap SemiConductor |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electrical and Electronic Engineering |
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