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| Content Provider | IET Digital Library |
|---|---|
| Author | Bezuidenhout, P. Smith, S. Land, K. Joubert, T H. |
| Abstract | This work details manufacturing processes developed to integrate an unpackaged silicon die onto a paper substrate, as part of constructing a hybrid inkjet-printed paper-based circuit. This integration between rigid components and flexible substrates is beneficial in low-cost applications and capitalises on the advantages of both the well-established integrated circuit technology and the emerging paper-based electronics platforms. A superglue incline at the chip edge formed a ramp for printing the silver interconnects between the paper-based circuit and the chip pads. Two printing protocols are compared, the first a single layer using 5 μm drop spacing, and the second using a 35 μm drop spacing for three layers. An unpackaged RFID tag die is successfully integrated and is presented as proof of concept. |
| Starting Page | 252 |
| Ending Page | 254 |
| Page Count | 3 |
| ISSN | 00135194 |
| Volume Number | 55 |
| e-ISSN | 1350911X |
| Issue Number | Issue 5, Mar (2019) |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/el/55/5 |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/10.1049/el.2018.6839 |
| Journal | Electronics Letters |
| Publisher Date | 2019-01-24 |
| Access Restriction | Open |
| Rights Holder | © The Institution of Engineering and Technology |
| Subject Keyword | Flexible Electronics Flexible Substrates Hybrid Inkjet-printed Paper-based Circuit Ink Jet Printing Inkjet-printed Interconnection Integrated Circuit Technology Paper-based Electronics Platform Printing Protocol Product Packaging Radiofrequency Identification RFID System Silicon Silver Compound Silver Interconnect Unpackaged RFID Tag Die Unpackaged Silicon |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electrical and Electronic Engineering |
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