NDLI: MEMS vs. IC manufacturing: Is integration between processes possible

Content Provider	IEEE Xplore Digital Library
Author	Vemal, R. Lo, C. Ong, S. Lee, B.S. Yong, C.C.
Copyright Year	2009
Description	Author affiliation: Packaging Solutions Development, Technology Solutions Organization (TSO), Freescale Semiconductor (M) Sdn Bhd, 2, Jln SS8/2, FTZ Sg Way, 47300 P.J. Selangor, Malaysia (Vemal, R.; Lo, C.; Ong, S.; Lee, B.S.; Yong, C.C.)
Abstract	Microelectromechanical systems (MEMS) remain one of the fastest growing markets in the semiconductor technology industry. This growth is largely due to the increasing possibility of integration into various applications. These include the automotive industry, process control and automation, scientific and medical instrumentation, telecommunication, commodity products and environmental monitoring. Much of the process technology for MEMS in terms of wafer and package level manufacturing has been sought from the rather established IC (Integrated Circuit) industry. In some cases, the processes and application of materials have been a direct replicate of existing practices. However, the question remains to what extent can we apply the IC replication process for MEMS while taking into consideration the much more delicate nature of MEMS parts for reliability's sake. There needs to be a thorough analysis on these differences to determine if a new standard of manufacturing is needed. If this point is neglected for the sake of cost saving in manufacturing operations, there is a high possibility the integrity of the MEMS parts will suffer with subsequent downstream processing. This literature work aims to provide a much deeper and in-depth understanding in this area from a packaging point-of-view. We will revisit the various processes and fundamental differences between MEMS and IC packaging.
Starting Page	39
Ending Page	43
File Size	843011
Page Count	5
File Format	PDF
ISBN	9781424449521
DOI	10.1109/ASQED.2009.5206300
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-07-15
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Micromechanical devices Manufacturing industries Microelectromechanical systems Manufacturing processes Industrial control Communication industry Semiconductor device manufacture Electrical equipment industry Integrated circuit packaging Automotive engineering
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in