NDLI: Large-scale and flexible MEMS-IC integration by using carrier wafer

Content Provider	IEEE Xplore Digital Library
Author	Jian Lu Takagi, H. Nakano, Y. Maeda, R.
Copyright Year	2012
Description	Author affiliation: Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), National Institute of Advanced, Industrial Science and Technology (AIST), Namiki 1-2-1, Tsukuba, Ibaraki, JAPAN (Jian Lu; Takagi, H.; Nakano, Y.; Maeda, R.)
Abstract	This paper presents our recent progress on a flexible and size-free MEMS-IC integration process for MEMS ubiquitous applications in wireless sensor network (WSN). In our proposal, MEMS and IC known-good-dies (KGD) are temporarily bonded onto carrier wafer with rapid and high-accurate self-alignment by using hydrophobic surface assembled monolayer (SAM) fine pattern and capillary force of H2O; and then those KGDs are transferred from carrier wafer to target wafer by using low damage metal to metal permanent bonding with plasma surface activation prior to bonding to reduce bonding temperature and bonding load force. By applying above 2 steps for MEMS-IC integration, size of both MEMS/IC processed wafers and dies is flexible, and various MEMS/IC KGDs can be integrated with high efficiency and relatively low cost.
Starting Page	93
Ending Page	97
File Size	1639342
Page Count	5
File Format	PDF
ISBN	9781467307857
e-ISBN	9782355000218
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-04-25
Publisher Place	France
Access Restriction	Subscribed
Rights Holder	CMP
Subject Keyword	Micromechanical devices Integrated circuits Temperature measurement Gold Wireless sensor networks Bonding Plasma temperature
Content Type	Text
Resource Type	Article

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