NDLI: Effects of thermal interface materials (solders) on thermal performance of a microelectronic package

Content Provider	IEEE Xplore Digital Library
Author	Ekpu, M. Bhatti, R. Ekere, N. Mallik, S. Otiaba, K.
Copyright Year	2012
Description	Author affiliation: Manufacturing Engineering Research Group, School of Engineering, University of Greenwich at Medway, Chatham, ME4 4TB, Kent, UK (Ekpu, M.; Bhatti, R.; Ekere, N.; Mallik, S.; Otiaba, K.)
Abstract	The increase in thermal failures associated with the operations of microelectronic devices at elevated temperature has accounted for some of their recent reliability concerns. The removal of heat with heat sink from chip level devices used in microelectronics assembly such as laptop computers is the key to achieving high reliability. Normally, when a heat sink is mounted on the chip level device, the surface roughness which exists at the interface is filled with air and it impacts heat transfer across the boundaries. Thermal interface materials (TIMs) are used to eliminate the interstitial air gaps from the interface by conforming to the topography of the surfaces in contact. In this paper, steady state thermal analysis built into finite element method was employed. The architecture and thermal conductivity of solder TIMs were varied to investigate their impact on thermal resistance of the TIM which in turn influences the thermal performance of the electronic package. The results obtained show that a solder thermal conductivity and bond line thickness less than 0.1 mm does not have a great impact on the thermal performance of the microelectronic device. In addition, a 75% and above TIM coverage area is required for optimum thermal performance. It is anticipated that the results will assist design engineers involved in setting standard for TIM architecture and thermal conductivity.
Starting Page	154
Ending Page	159
File Size	469566
Page Count	6
File Format	PDF
ISBN	9781467307857
e-ISBN	9782355000218
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-04-25
Publisher Place	France
Access Restriction	Subscribed
Rights Holder	CMP
Subject Keyword	Thermal resistance Conductivity Thermal conductivity Electronic packaging thermal management Microelectronics Heat sinks
Content Type	Text
Resource Type	Article

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