NDLI: Fabrication of wireless sensor platform on transparent flexible film using screen printing and via interconnect

Content Provider	IEEE Xplore Digital Library
Author	Shi, C.W.P. Xuechuan Shan Tarapata, G. Jachhowicz, R. Lu, C.W. Hui, H.T.
Copyright Year	2010
Description	Author affiliation: Singapore Institute of Manufacturing Technology (SIMTech), 71 Nanyang Drive, Singapore 638075 (Shi, C.W.P.; Xuechuan Shan; Lu, C.W.) \|\| Institute of Electronic Systems, Warsaw University of Technology, Nowowiejska, Poland (Tarapata, G.; Jachhowicz, R.) \|\| Department of Electrical & Computer Engineering, National University of Singapore, Singapore 117576 (Hui, H.T.)
Abstract	We present a wireless sensor platform that is fabricated on transparent flexible substrate by means of screen printing. The platform is battery free with data and power transmission functions. The smart sensor, fabricated on polyethylene terephtalate (PET) film, is designed based on RFID technology. Using an additive patterning process known as screen printing, metallization on the polymer substrates is created. Both sides of the polymer substrate are printed with metallic patterns and connected with micro vias filled with a conductive paste. One side of the substrate consists of printed electrical traces for components like resistors, capacitors, transistors that would be mounted onto it; the other side consists of a printed inductive coil used for wireless data and power transmission. The micro vias, which have a diameter of 120 µm, are formed by mechanical punching and filled with conductive silver paste. The size of one sensor unit is approximately 2 cm × 1.5 cm; an array of 4×7 sensor units are printed over an area of 15 cm × 15 cm on a PET film. The advantages of using polymer substrate are weight reduction and its ability to flex. This paper presents the details of manufacturing processes, component assembly and functionality test.
Starting Page	209
Ending Page	214
File Size	367344
Page Count	6
File Format	PDF
ISBN	9781424466368
e-ISBN	9782355000119
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-05-05
Publisher Place	Spain
Access Restriction	Subscribed
Rights Holder	EDA Publishing
Subject Keyword	Fabrication Printing Mechanical sensors Wireless sensor networks Power transmission Polymers Positron emission tomography Substrates Intelligent sensors Sensor arrays
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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