NDLI: Study of mechanical response in embossing of ceramic green substrate by micro-indentation

Content Provider	IEEE Xplore Digital Library
Author	Liu, Y.C. Xuechuan Shan
Copyright Year	2008
Description	Author affiliation: Singapore Inst. of Manuf. Technol., Singapore (Liu, Y.C.; Xuechuan Shan)
Abstract	Micro-indentation test with a micro flat-end cone indenter was employed to simulate micro embossing process and investigate the thermo-mechanical response of ceramic green substrates. The laminated low temperature co-fired ceramic green tapes were used as the testing material; the correlations of indentation depth versus applied force and applied stress at the temperatures of 2SdegC and 75degC were studied. The results showed that permanent indentation cavities could be formed at temperatures ranging from 25degC to 75degC, and the depth of cavities created was applied force, temperature and dwell time dependent. Creep occurred and made a larger contribution to the plastic deformation at elevated temperatures and high peak loads. There was instantaneous recovery during the unloading and retarded recovery in the first day after indentation. There was no significant pile-up due to material flow observed under compression at the temperature up to 75degC. The plastic deformation was the main cause for formation of cavity on the ceramic green substrate under compression. The results can be used as a guideline for embossing ceramic green substrates.
Starting Page	320
Ending Page	325
File Size	2410587
Page Count	6
File Format	PDF
ISBN	9782355000065
DOI	10.1109/DTIP.2008.4753010
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-04-09
Publisher Place	France
Access Restriction	Subscribed
Rights Holder	TIMA
Subject Keyword	Temperature dependence Temperature distribution Materials testing Embossing Creep Thermomechanical processes Ceramics Plastics Thermal stresses Guidelines
Content Type	Text
Resource Type	Article

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