NDLI: Large area roller embossing of multilayered ceramic green composites

Content Provider	IEEE Xplore Digital Library
Author	Xuechuan Shan Soh, Y.C. Shi, C.W.P. Tay, C.K. Lu, C.W.
Copyright Year	2008
Description	Author affiliation: Singapore Inst. of Manuf. Technol., Singapore (Xuechuan Shan; Soh, Y.C.; Shi, C.W.P.; Tay, C.K.; Lu, C.W.)
Abstract	This paper presents our latest achievements in developing large area patterning of multilayered ceramic green composites using micro roller embossing. The aim of this research is to develop large area pattern technique for ceramic green substrates using a modified roller laminator, which is compatible with screen printing apparatus, for integration of micro embossing and printing in the future stage. A thin film nickel mold was developed via photolithography, nickel electroplating and photoresist strip-off. The mold had an effective panel size of 150 mmtimes 150 mm with the height of protrusive micro patterns being about 40 mum. Formation of micro patterns was successfully demonstrated over the whole panel area using roller embossing on laminated ceramic green tapes (HL2000 from Heraeus). Micro patterns for inductors, capacitors as well as interconnection with 50 mum line width were embossed on ceramic green substrates. With the optimized process parameters (including feeding speed, roller temperature and applied pressure), we have demonstrated that micro roller embossing is a promising method for large area patterning of ceramic green substrates.
Starting Page	314
Ending Page	319
File Size	5699522
Page Count	6
File Format	PDF
ISBN	9782355000065
DOI	10.1109/DTIP.2008.4753009
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-04-09
Publisher Place	France
Access Restriction	Subscribed
Rights Holder	TIMA
Subject Keyword	Printing Embossing Lithography Capacitors Resists Nickel Ceramics Transistors Inductors Substrates
Content Type	Text
Resource Type	Article

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