NDLI: 3D TLM formulation for thermal modelling of Metal matrix composite materials for space electronics systems

Content Provider	IEEE Xplore Digital Library
Author	Hocine, R. Boudjemai, A. Boukortt, A. Belkacemi, K.
Copyright Year	2013
Description	Author affiliation: Fac. des Sci. & Technol., Univ. Abdelhamid Ibn Badis de Mostaganem, Mostaganem, Algeria (Boukortt, A.) \|\| Centre of Satellite Dev. (CDS), Oran, Algeria (Boudjemai, A.; Belkacemi, K.) \|\| Dept. of Electron. Eng., USTOMB, Oran, Algeria (Hocine, R.)
Abstract	This Metal matrix composites (MMCs) are finding widespread use in the automotive and aerospace industry where strength, weight, thermal conductivity and thermal expansion are important. They are a composite of an element or alloy metal bound into a `matrix' structure, formed by a reaction synthesis process. The most common material combinations are aluminum (Al) and silicon carbide (SiC). Because of their composite nature, the properties of MMCs can be tailored to suit the particular application based on the contribution of individual materials. Current applications find them in automotive, aircraft brake rotors and space electronic packaging, where toughness and dimensional stability at temperature extremes are important. Several silicon-carbide particulate (p) reinforced aluminium (SiC/Al) and graphite/ aluminium (Gr/Al), electronic packages have been space-qualified and are now flown on communication satellites and Global Positioning System satellites. The most significant problem in the space power electronic module concept is the issue of adequate thermal management and consequent electrical performance. It is believed that a Metal Matrix Composite (MMC) heat spreader, with high thermal conductivity and low CTE has the potential to solve many of these thermal management issues. Applied to electronics cooling applications, the primary advantage of MMCs is the ability to tailor the CTE to match bonded and mating materials, such as copper, braze material, ceramic substrates, and silicon in one hand and in other hand as the electronics devices get smaller and smaller, self-heating becomes important and changes the electronic performance of device. This thermal-electronic coupling effect often results in thermal runaway and hence the breakdown of the device. In this paper, an investigation of the thermal behavior of space electronics devices using a Metal Matrix Composite Materials, using the Transmission -Line-Matrix (TLM) method, is exposed. The technique has been successful in modeling various heat diffusion and mass transport problems and has proven to be efficient in terms of stability, complex geometries and the incorporation of non linear material properties. The three dimensional results show that the method has a considerable potential in small devices thermal analysis and design. The results show that the development of MMCs for use in the Space Electronics Systems thermal design is quite promising considering the superior thermal characteristics.
Sponsorship	IEEE Aerosp. Electron. Syst. Soc.
Starting Page	47
Ending Page	52
File Size	1024047
Page Count	6
File Format	PDF
ISBN	9781467363952
e-ISBN	9781467363969
DOI	10.1109/RAST.2013.6581254
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-06-12
Publisher Place	Turkey
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Insulated gate bipolar transistors Conduction 3D-TLM Heat spreader Materials Aerospace electronics Thermal Management Power electronics Time-varying systems Nodes Heat dissipation Heating CTE MMC materials Thermal conductivity Ceramic Mathematical model
Content Type	Text
Resource Type	Article

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