NDLI: HMIC 3-D chipscale, surface mount devices

Content Provider	IEEE Xplore Digital Library
Author	Boles, T. Brogle, J. Rozbicki, A.
Copyright Year	2011
Description	Author affiliation: M/A-COM Technology Solutions, 100 Chelmsford Street, Lowell, Massachusetts 01851, USA (Boles, T.; Brogle, J.; Rozbicki, A.)
Abstract	Broadband components continue have the basic issues of fundamental high frequency performance and unit-to-unit reproducibility. While possible solutions to these two basic problems exist, it is universally acknowledged that both the basic semiconductor performance at frequencies above 10 GHz and the unit variation are severely limited by packaging, die attach, and chip and wire assembly techniques. The purpose of this paper is to present a unique, fundamentally different approach to the packaging and monolithic integration of ultra wideband switches which not only includes the electrical input/output but also device thermal heat sinking. This method is based upon a technology, HMIC, which utilizes standard semiconductor wafer scale processes to realize the final monolithic, surface mountable element, in this case a single pole four throw multi octave switch.
Starting Page	1
Ending Page	4
File Size	588156
Page Count	4
File Format	PDF
ISBN	9781457716928
e-ISBN	9781457716942
DOI	10.1109/COMCAS.2011.6105782
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-11-07
Publisher Place	Israel
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Radio frequency Surface impedance Microwave integrated circuits PIN Diode Switches Integrated Circuits Insertion loss Switches Glass Technology Microwave circuits Surface Mount Packaging Microwave transistors
Content Type	Text
Resource Type	Article

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