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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | So Hyeon Mun Jong Hwa Choi Moo Whan Shin |
| Copyright Year | 2011 |
| Description | Author affiliation: School of Integrated Technology and YICT College of Engineering, Yonsei University, 162-1 Songdo-dong, Yeonsu-gu, Incheon, 406-840, Korea (Moo Whan Shin) || Department of Material Science and Engineering, Myong Ji University, 38-2 Nam-Dong, Yongin, Kyunggi, 449-728, Korea (So Hyeon Mun; Jong Hwa Choi) |
| Abstract | Thermal problem is still a bottleneck to limit the stability, reliability, and lifetime of High power light emitting diodes (LEDs). More effective thermal design LED packages with low thermal resistance is critical to improve the performance of LEDs. In this paper we present thermal analysis of type of thermal performances of the plastic package and metal package of LEDs. The analysis was made by transient thermal measurement. The two kind of ceramic packages under investigation employ same configuration of GaN-based chip, but they have different structure, size and distribution thermal vias. Two design of LED packages resulted in significantly different thermal performance. Thermal properties, described as thermal resistance, of two package design, were compared and evaluated. It was demonstrated that the junction temperature decrease with effective contact in the LED packages. |
| Starting Page | 1 |
| Ending Page | 5 |
| File Size | 494639 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781457707780 |
| e-ISBN | 9782355000164 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-09-27 |
| Publisher Place | France |
| Access Restriction | Subscribed |
| Rights Holder | CMP |
| Subject Keyword | Cooling Thermal resistance Heating Light emitting diodes Electronic packaging thermal management Thermal conductivity |
| Content Type | Text |
| Resource Type | Article |
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