NDLI: A novel temperature compensation method for SAW devices using direct bonding techniques

Content Provider	IEEE Xplore Digital Library
Author	Onishi, K. Namba, A. Sato, H. Ogura, T. Seki, S. Taguchi, Y. Tomita, Y. Kawasaki, O. Eda, K.
Copyright Year	1997
Description	Author affiliation: Device Eng. Dev. Center, Matsushita Electr. Ind. Co. Ltd., Kadoma, Japan (Onishi, K.)
Abstract	We have developed a novel temperature compensation method for SAW devices using a direct bonding technique. The SAW device applied this method was composed of a conventional piezoelectric substrate such as LiTaO/sub 3/ and LiNbO/sub 3/, directly bonded without any bonding agents to a glass substrate having a relatively low thermal expansion coefficient (TEC). The piezoelectric substrate and the glass substrate were bonded in an atomic scale and the interface was very uniform. Therefore, the thermal strain at the surface of the bonded substrate caused by the difference between the TECs of the substrates was quite uniform and stable. With this structure, the thermal expansion of the piezoelectric substrate was restrained and the elastic constant of the piezoelectric substrate was changed by the thermal strain. Using this technique, we have succeeded to improve the temperature coefficient of frequency (TCF) of the SAW devices without causing any deterioration in the frequency response. This novel temperature compensation method is very promising for RF-SAW device applications.
Starting Page	227
Ending Page	230
File Size	256449
Page Count	4
File Format	PDF
ISBN	0780341538
ISSN	10510117
DOI	10.1109/ULTSYM.1997.663015
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-10-05
Publisher Place	Canada
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature Surface acoustic wave devices Bonding Substrates Thermal expansion Piezoelectric materials Piezoelectric films Piezoelectric devices Glass Capacitive sensors
Content Type	Text
Resource Type	Article

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