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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Pazol, B.G. Bowen, L.J. Gentilman, R.L. Pham, H.T. Serwatka, W.J. Oakley, C.G. Dietz, D.R. |
| Copyright Year | 1995 |
| Description | Author affiliation: Materials Systems Inc., Littleton, MA, USA (Pazol, B.G.) |
| Abstract | Intravascular and endoscopic acoustic imaging typically require high ultrasonic operating frequencies, over 7 MHz. At these frequencies the ceramic transducer dimensions become very small; pitches in the order of 20 to 80 /spl mu/m are needed. Moreover, such arrays must be compatible with existing interconnect approaches and be fabricated at low cost. These piezoelectric transducer array requirements severely challenge the ability of conventional PZT ceramic technologies in terms of cost-effective fabrication. To meet the demand for such transducer shapes, MSI has developed a net shape ceramic injection molding process for production of piezoelectric ceramics in complex shapes. Using this technique, MSI has produced ultrafine scale 2-2 piezocomposite arrays having PZT elements less than 25 /spl mu/m wide and pitches under 50 /spl mu/m. This paper reviews recent advances in the net shape molding technology, and compares the characteristics of an injection molded 7 MHz 2-2 configuration with that of a similar array prepared by conventional dicing. |
| Starting Page | 1263 |
| Ending Page | 1268 |
| File Size | 388436 |
| Page Count | 6 |
| File Format | |
| ISBN | 0780329406 |
| ISSN | 10510117 |
| DOI | 10.1109/ULTSYM.1995.495787 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1995-11-07 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Composite materials Ceramics Shape Piezoelectric transducers Frequency Acoustic imaging Acoustic transducers Ultrasonic transducers Costs Fabrication |
| Content Type | Text |
| Resource Type | Article |
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