NDLI: Development platform for WIP bond quality testing system

Content Provider	IEEE Xplore Digital Library
Author	Goh, K.M. Huang, S. Phua, G.H. Aenderoomer, A.
Copyright Year	2010
Description	Author affiliation: Manufacturing Execution and Control Group, Singapore Institute of Manufacturing Technology (SIMTech), Singapore (Goh, K.M.; Huang, S.; Phua, G.H.; Aenderoomer, A.)
Abstract	Development of a work in progress (WIP) quality testing system is complex and requires significant effort in design, coding and integration the software with hardware components. On top of that, various regulations and testing procedures need to be observed during the testing. This paper presents a distributed control application platform (DCAP) to improve the development time and allow reusability. The platform includes building blocks, template libraries, best practices, and design patterns which can be easily deployed in various applications. A case study of developing a semiconductor WIP bond quality testing system was used to validate the platform together with an industrial partner. The result shows that a configurable, flexible and extensible WIP bond quality testing system can be developed using the platform in a shorter period of time. The WIP quality testing system can be configured to perform both destructive and non-destructive testing of wire bonding, ball bonding and die bonding by applying force to measure. The DCAP platform helps in providing the building blocks for manufacturing execution and control applications. The cross-platform nature with extensibility and flexibility features will help in various future industrial and research applications development.
Starting Page	433
Ending Page	438
File Size	622999
Page Count	6
File Format	PDF
ISBN	9781424450459
e-ISBN	9781424450466
DOI	10.1109/ICIEA.2010.5517164
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-06-15
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	System testing Nondestructive testing Bonding forces Force measurement Software testing Software quality Hardware Distributed control Application software Software libraries Software controller Software development platform Bond testing
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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