NDLI: Environment-friendly PVD Al-plug process for submicron multilayer interconnection

Content Provider	IEEE Xplore Digital Library
Author	Liu Jian Huang Rongxu Jiang Juxiao Zheng Guoxiang
Copyright Year	2004
Description	Author affiliation: Dept. of Mater. Sci., Fudan Univ., Shanghai, China (Liu Jian)
Abstract	IC industries are now under heavy pressure to develop electronics that lessen the environmental pressure. Green electronics calls for more environment-friendly manufacturing processes. An aluminum reflow process for metallization simply employing a PVD cluster tool, instead of CVD-tungsten fixtures, was successfully applied to fabricate IC wafers of narrow line width. Compared with tungsten, aluminum plugs can be formed in vias and contacts by PVD method which contributes to no precursor and little by-products. It also benefits the environment by saving process steps and equipment. Moreover, unlike refractory metals, aluminum is among the selected materials for electronic products for its recyclability after disposal. This paper will show how this green process can realize multilayer interconnection in submicron scope that used to be achieved only by tungsten. Voids in contacts and vias are eliminated by the thermal diffusion of aluminum atoms. Different conditions including two-step process are used to treat device wafers. The step coverages of contacts are tested to investigate both temperature and power dependence of the ability of aluminum to diffuse into the void during reflow steps. The mechanism of reflow is demonstrated theoretically and experimentally. The optimal processing condition is. also obtained through the experiments.
Sponsorship	Surface Mount Technol. (Holdings) Ltd. Kasion Automation Ltd. Surface Mount Technol. Automation (SMTA) Hong Kong Electronic Packaging & Manufacturing Services Association (EPMSA) Buehler Asia-Pacific Philips BCU Audio Video Entertainment Unicon Scientific Co. Ltd. Esterline Technol. (HK) Ltd. Business Environment Council Refined Industry Co. Ltd. SFI Technol. Ltd. Optimal Technol
Starting Page	92
Ending Page	95
File Size	231417
Page Count	4
File Format	PDF
ISBN	078038203X
DOI	10.1109/AGEC.2004.1290876
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-01-07
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Atherosclerosis Nonhomogeneous media Aluminum Tungsten Electronics industry Manufacturing industries Industrial electronics Manufacturing processes Metallization Fixtures
Content Type	Text
Resource Type	Article

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