NDLI: Stencil Design for Lead-Free Reflow Process

Content Provider	IEEE Xplore Digital Library
Author	Steplewski, W. Koziol, G.
Copyright Year	2007
Description	Author affiliation: Tele & Radio Res. Inst., Warsaw (Steplewski, W.; Koziol, G.)
Abstract	Following the trend toward miniaturization, manufactured components across end-user industries such as electronics, automotive and other industrial applications are becoming smaller in size. From July 2006 has came into force the RoHS Directive on the restrictions of the use of certain hazardous substances in electrical and electronic equipment. In Tele and Radio Research Institute was pursued works to face the problem of lead free assembly implementation due to RoHS Directive. We put the special attention to miniature components. In the paper there are presented the result of investigation of stencil design, solder paste printing process and solder paste wetting and spread characteristics for both the smallest components on the board (including 0201 and 01005 component) and the largest components on the board. A quality assessment consisting of solder wetting/spread and coalescence, volume and shape of printed solder paste (3D inspection) as well as cross-section of solder joints were performed.
Starting Page	330
Ending Page	334
File Size	3677348
Page Count	5
File Format	PDF
ISBN	9781424412174
DOI	10.1109/ISSE.2007.4432873
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-05-09
Publisher Place	Romania
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Environmentally friendly manufacturing techniques Lead Electrical equipment industry Electronics industry Manufacturing industries Electronic equipment manufacture Industrial electronics Automotive engineering Electronic equipment Assembly
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Environmental tests for automotive electronic devices produced by lead-free technology

Optimising lead-free screen-printing and reflow process parameters

The impact of lead-free legislation exemptions on the electronics industry

Understanding the process window for printing lead-free solder pastes

The challenge of lead-free electronics for aerospace electronic systems

Environmental Conservation Through Lead-Free Electronics Manufacturing

Quality and reliability assurance by implementation of lead-free technology in electronic industry

The Key Indicators of Lead-Free Manufacturing in Electronics Industry in Taiwan and Japan

Implementing 0201s On High-Density Lead-Free Memory Modules

Stencil Design for Lead-Free Reflow Process

Similar Documents

Environmental tests for automotive electronic devices produced by lead-free technology

Optimising lead-free screen-printing and reflow process parameters

The impact of lead-free legislation exemptions on the electronics industry

Understanding the process window for printing lead-free solder pastes

The challenge of lead-free electronics for aerospace electronic systems

Environmental Conservation Through Lead-Free Electronics Manufacturing

Quality and reliability assurance by implementation of lead-free technology in electronic industry

The Key Indicators of Lead-Free Manufacturing in Electronics Industry in Taiwan and Japan

Implementing 0201s On High-Density Lead-Free Memory Modules

Stencil Design for Lead-Free Reflow Process