NDLI: Residual stress induced deformation of bilayer plate with patterned additional layer

Content Provider	IEEE Xplore Digital Library
Author	Da-Yong Qiao Wei-Zheng Yuan Wei-Jian Li
Copyright Year	2004
Abstract	Bilayer material systems find wide application in Micro ElectroMechanical systems (MEMS)., especially serving the reflective surface roles in optical MEMS. Unlike the bilayer with fully covered additional layer, the stress related deformation of bilayer with patterned additional layer has been rarely studied. In this paper, we present the out-of-plane deformation response of polysilicon plate with patterned gold layer subjected to residual stress. Stress gradient through the thickness of the polysilicon plate is taken into account to iintroduce a initially dome shaped deformation into the polysiliconi plate. Because this kind of bilayer is mainly used in flat micromirror, the commercially available microlens determines the size of the mirror plate and the fabrication foundry determines the thickness of the additional layer, only the rlelationship between the deformation and the gold pad size was situdied. In order to understand the influence of the residual stress of the gold layer, different residual stresses were tried. The average curvature approach proved not suitable to characterize the deformation of this kind of bilayer plate,. and the peak-to-valley (PV) flatness was proposed. The result of numerical analysis shows under given residual stress of gold layer, there is one and only one minimum PV point. Increasing of additional layer residual stress will decrease the minimum PV related gold pad size, but increase the minimum PV.
Starting Page	288
Ending Page	292
File Size	481952
Page Count	5
File Format	PDF
ISBN	0780387481
DOI	10.1109/ICIMA.2004.1384206
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-08-26
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Residual stresses Gold Micromirrors Micromechanical devices Thermal stresses Temperature Optical materials Electromechanical systems Lenses Microoptics
Content Type	Text
Resource Type	Article

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