NDLI: Hot-via interconnects: a step toward surface mount chip scale packaged MMICs up to 110 GHz

Content Provider	IEEE Xplore Digital Library
Author	Bessemoulin, A. Gaessler, C. Gruenenpuett, C. Reig, B.
Copyright Year	2004
Description	Author affiliation: United Monolithic Semicond., Orsay, France (Bessemoulin, A.; Gaessler, C.; Gruenenpuett, C.; Reig, B.)
Abstract	Two new techniques based on the RF hot-via concept have been developed for use in chip-scale packaged (CSP) MMICs. The first one utilizes backside bumps for die attach onto a substrate carrier; excellent RF performance has been achieved on both active-, and passive MMIC devices up to 110 GHz. The second technique is based on direct soldering of the MMIC backside interconnects onto low cost substrate carrier (RO4003), making it ideal for a wire-bond free full surface mount approach. To the author's knowledge this is the first demonstration of such die attach-, and packaging techniques for MMICs. As application examples, experimental performance results obtained with both techniques, are presented for transmission lines, and broadband 30-GHz GaAs PHEMT amplifier MMICs.
Sponsorship	IEEE Electron Devices Soc
Starting Page	237
Ending Page	240
File Size	380189
Page Count	4
File Format	PDF
ISBN	0780386167
ISSN	15508781
DOI	10.1109/CSICS.2004.1392548
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-10-24
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Chip scale packaging MMICs Radio frequency Microassembly Soldering Costs Transmission lines Gallium arsenide PHEMTs Broadband amplifiers
Content Type	Text
Resource Type	Article

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