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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Tze-chiang Chen |
| Copyright Year | 2010 |
| Description | Author affiliation: T.J. Watson Res. Center, IBM, Yorktown Heights, NY, USA (Tze-chiang Chen) |
| Abstract | The continuous scaling of CMOS technology has enabled system performance to double every two years for the past 40 years. However, new classes of applications will demand a much faster rate of improvement such as 2×/year in order to reach exaflop capabilities by the end of this decade. These applications represent a significant growth opportunity and require continued innovation in solid state technology including a new generation of silicon device scaling and a number of non-silicon logic switches which have been proposed as replacements. In addition, new system architectures will take advantage of 3D chip technology to enable a higher level of hybrid integration. New memory technology will allow implementation of a new level of memory architecture, while silicon nanophotonics on the processor will meet ultra-low power, low cost, and high density communications needs. These and other innovations will lead to significant improvement in systems integration, performance, and power efficiency for future applications. The roadmap that will be presented will drive semiconductor technology for decades to come. |
| Starting Page | 2 |
| Ending Page | 5 |
| File Size | 667387 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424450633 |
| ISSN | 1524766X |
| DOI | 10.1109/VTSA.2010.5488971 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-04-26 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Technological innovation Solid state circuits CMOS technology System performance Silicon devices Logic devices Switches Memory architecture Nanophotonics Costs |
| Content Type | Text |
| Resource Type | Article |
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