NDLI: A framework for multilevel interconnection technology

Content Provider	IEEE Xplore Digital Library
Author	Pai, P.L. Ting, C.H. Oldham, W.G.
Copyright Year	1988
Description	Author affiliation: Intel Corp., Santa Clara, CA, USA (Pai, P.L.; Ting, C.H.)
Abstract	The process steps in general VLSI technology are examined, and categorized according to their contribution in the generation or elimination of surface topography. It is found that only a few combinations of processes lead to truly planarized processes. The metallization step is studied in detail. Process compatibility considerations eliminate the majority of possible ways to construct a metal layer, and leave only seventeen candidates for further consideration. Four out of the seventeen processes require no planarization and are considered promising as the base process for future interconnection technology. A common requirement of the four processes is the use of additive patterning instead of metal etching. Two examples of additive patterning are examined experimentally: one uses lift-off and the other uses selective electroless deposition. The flat surfaces obtained in these examples demonstrate the potential for future interconnection technologies with an unlimited number of conductive layers.
Starting Page	108
Ending Page	114
File Size	436253
Page Count	7
File Format	PDF
DOI	10.1109/VMIC.1988.14182
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1988-06-13
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Surface topography Geometry Metallization Planarization Wet etching Very large scale integration Additives Coatings Sputtering Sputter etching
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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