NDLI: Size effect on the mechanical properties and reliability analysis of microfabricated polysilicon thin films

Content Provider	IEEE Xplore Digital Library
Author	Ding, J.N. Meng, Y.G. Wen, S.Z.
Copyright Year	2001
Description	Author affiliation: Natl. Tribology Lab., Tsinghua Univ., Beijing, China (Ding, J.N.)
Abstract	The increasing use of microelectromechanical systems (MEMS) and advanced sensors has led to concern about the failure modes and reliability of these structures. The wider acceptance of MEMS devices depends on the solution of issues associated with materials, design, and fabrication. The reliable mechanical properties of thin films are critical to the safety and functioning of these complex microdevices and should be accurately determined. In order to determine mechanical properties for reliable MEMS design, a new microtensile test device using a magnetic-solenoid force actuator was developed. Mechanical properties of microfabricated polysilicon thin films with dimensions of 100 to 660 /spl mu/m long, 20 to 200 /spl mu/m wide, and 2.4 /spl mu/m thick were evaluated. It was found that the average value of Young's modulus, 164 GPa/spl plusmn/1.2 GPa, falls within the theoretical bounds. The average fracture strength was 1.36 GPa with a standard deviation of 0.14 GPa, and the Weibull moduli were between 10.4 and 11.7. Statistical analysis of tensile strength for various specimen sizes predicted the effects of specimen length, surface area, and volume that occurs due to microstructural and dimensional constraints. The test data accounts for the uncertainties in mechanical properties of miniature elements and may be used for design of a reliable polysilicon MEMS. Based on the test results of 40 specimens to failure, it is recommended to maintain nominal strain below 0.0057 /spl mu/m//spl mu/m for a safe design.
Sponsorship	IEEE Electron Devices Soc.
Starting Page	106
Ending Page	111
File Size	703793
Page Count	6
File Format	PDF
ISBN	0780365879
DOI	10.1109/RELPHY.2001.922889
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-04-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Mechanical factors Micromechanical devices Testing Transistors Microelectromechanical systems Mechanical sensors Sensor systems Microelectromechanical devices Magnetic materials Fabrication
Content Type	Text
Resource Type	Article

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