NDLI: New On-Chip Nanomechanical Testing Laboratory - Applications to Aluminum and Polysilicon Thin Films

Content Provider	IEEE Xplore Digital Library
Author	Gravier, S. Coulombier, M. Safi, A. Andre, N. Boe, A. Raskin, J.-P. Pardoen, T.
Copyright Year	1992
Abstract	The measurement of the mechanical properties of materials with submicrometer dimensions is extremely challenging, from the preparation and manipulation of specimens to the application of small loads and extraction of accurate stresses and strains. A new on-chip nanomechanical testing concept has been developed in order to measure the mechanical properties of submicrometer freestanding thin films allowing various loading configurations and specimen geometries. The basic idea is to use internal stress present in one film to provide the actuation for deforming another film attached to the first film on one side and to the substrate on the other side. The measurement of the displacement resulting from the release of both films gives access to the stress and the strain applied to the test specimen provided the Young's modulus and mismatch strain of the actuator film are known. Classical microelectromechanical-systems-based microfabrication procedures are used to pattern the test structures and release the films from the substrate. The design procedures, data reduction scheme, and a generic fabrication strategy are described in details and implemented in order to build a suite of test structures with various combinations of dimensions. These structures allow the characterization of different materials and mechanical properties and enable high throughputs of data while avoiding any electrical signal or external actuation. Results obtained on ductile aluminum and brittle polysilicon films demonstrate the potential of the method to determine the Young's modulus, yield stress or fracture stress, fracture strain, and strain hardening in ductile materials.
Sponsorship	IEEE Electron Devices Society American Society of Mechanical Engineering (ASME)
Starting Page	555
Ending Page	569
Page Count	15
File Size	1172266
File Format	PDF
ISSN	10577157
Volume Number	18
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-06-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Testing Laboratories Aluminum Transistors Strain measurement Mechanical factors Mechanical variables measurement Stress measurement Substrates Capacitive sensors thin materials Mechanical properties microelectromechanical systems (MEMS) MEMS test structures nanomechanical testing release size effect
Content Type	Text
Resource Type	Article
Subject	Mechanical Engineering Electrical and Electronic Engineering

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