NDLI: The reliability challenge: New materials in the new millennium. Moore's Law drives a discontinuity

Content Provider	IEEE Xplore Digital Library
Author	England, J.S. England, R.W.
Copyright Year	1998
Description	Author affiliation: Texas Instrum. Inc., Dallas, TX, USA (England, J.S.)
Abstract	Nowhere is the pace of change so rapid or so dramatic as in the semiconductor industry. For any industry to sustain 15% growth per year over a 40-year period is remarkable, but in the next few years, that growth rate is expected to accelerate, creating an industry that rivals historically dominant industries such as automotive and steel for a share of the global economy. Moore's Law has proven remarkably successful in characterizing the growth of the semiconductor industry for the past three decades. During that period, the core microelectronic materials-silicon substrate, SiO/sub 2/-based dielectrics, and aluminum metallization-have undergone relatively minor perturbations. Now, however, a discontinuity in basic semiconductor materials will be necessary for the industry to continue on the curve described by Moore's Law. The materials on which careers have been based are giving way to new gate and interlevel dielectrics, and copper metallization is replacing aluminum-alloy metallization. Given the size of our industry and its impact on the global economy, an accelerated understanding of the reliability physics of these new materials is essential. This paper deals with the work environment, skills and methods required for the reliability scientist to prepare the semiconductor industry for the new millennium.
Starting Page	1
Ending Page	8
File Size	936740
Page Count	8
File Format	PDF
ISBN	0780344006
DOI	10.1109/RELPHY.1998.670435
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-03-31
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Materials reliability Semiconductor materials Electronics industry Metals industry Metallization Acceleration Moore's Law Dielectric substrates Dielectric materials Automotive engineering
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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