NDLI: Improving the manufacturing test interval and costs for telecommunication equipment

Content Provider	IEEE Xplore Digital Library
Author	Jain, A.K. Saraidaridis, C.I.
Copyright Year	1999
Description	Author affiliation: Lucent Technol., AT&T Bell Labs., Holmdel, NJ, USA (Jain, A.K.)
Abstract	Generally, most circuit packs of telecommunication systems are processed through a manufacturing test process that may include in-circuit test, functional test, factory environmental stress testing or environmental stress screening (ESS), and system tests. Some of these tests, like ESS, may also be due to customer or Bellcore requirements. However, it is both expensive and time consuming to process all production circuit packs through all these tests, particularly when the test yields in some of these tests are close to 100 percent, and the field reliability performance is much better than expected. In this paper, we describe an approach for developing sampling plans for performing these tests. We feel that this approach of using production sampling plans in manufacturing coupled with statistical analysis of factory test yield and field reliability data to identify the best circuit pack candidates, can be applied to any large production volume telecommunication system for reducing both the manufacturing test interval and costs.
Starting Page	410
Ending Page	417
File Size	734913
Page Count	8
File Format	PDF
ISBN	0780351436
DOI	10.1109/RAMS.1999.744152
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-01-18
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Costs Circuit testing System testing Production facilities Stress Electronic switching systems Sampling methods Production systems Manufacturing processes Performance evaluation
Content Type	Text
Resource Type	Article

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