NDLI: Highly linear upconverter MMIC designs with complete package and test board effects for CDMA applications

Content Provider	IEEE Xplore Digital Library
Author	Wu, J.M. Jau, J.K. Horng, T.S. Tu, C.C.
Copyright Year	2003
Description	Author affiliation: Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaoshiung, Taiwan (Wu, J.M.; Jau, J.K.; Horng, T.S.)
Abstract	1.9 GHz upconverter MMICs are designed and implemented using GaAs HBT foundry process. A crucial goal for the design is to achieve the high linearity required in CDMA systems with low idle currents. In addition, complete package and test board effects need to be considered rigorously. The proposed design adopts a class-AB input stage in a Gilbert cell to enhance the linearity. Another design based on the conventional emitter degeneration technique is also implemented on the same chip for comparison. The chip is finally housed in a 24-pin bump-chip carrier (BCC) package and surface-mounted on a test board. Both RF and LO ports are internally matched to 50 /spl Omega/ on chip. A single supply voltage of 3V is used. The measured results show that with a reference input power of -10 dBm for IS-95 CDMA applications, the class-AB design achieves an adjacent channel power ratio (ACPR) of -44.9 dBc with a consumed current of 15 mA, while the emitter degeneration design achieves an ACPR of -43.8 dBc with a consumed current of 28.5 mA.. Package and test board effects are analyzed using the 3-D EM simulation tool and transformed into the equivalent-circuit elements. The simulation including package and test board effects can predict the measured results quite well.
Sponsorship	IEEE Microwave Theory & Tech. Soc. IEEE Electron. Device Soc. IEEE Solid States Circuits Soc
Starting Page	405
Ending Page	408
File Size	273965
Page Count	4
File Format	PDF
ISBN	0780376943
ISSN	15292517
DOI	10.1109/RFIC.2003.1213972
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-06-09
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	MMICs Packaging Testing Multiaccess communication Linearity Gallium arsenide Heterojunction bipolar transistors Foundries Radio frequency Voltage
Content Type	Text
Resource Type	Article

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