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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Fouracre, R.A. Fu, L. |
| Copyright Year | 1988 |
| Description | Author affiliation: Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK (Fouracre, R.A.) |
| Abstract | A regression experimental design has been used to study the effects of temperature, curing time, and ratio of resin to hardener on the cure of an epoxy resin. It was found that these parameters can be used to characterize the resin using a second-degree polynomial to define the cure state. Important characteristics could be derived from this polynomial. An advantage of the method is that it needs far fewer sets of measurements to fully characterize the system with respect to the influence of several variables than the factorial design and regression methods taken separately. The method lends itself to the use of a microcomputer for both regression analysis and the prediction of curing parameter values for specific conditions, and minimizes the amount of experimental work required to obtain the characterization. An analysis of experimental results is presented. |
| Starting Page | 539 |
| Ending Page | 542 |
| File Size | 198221 |
| Page Count | 4 |
| File Format | |
| DOI | 10.1109/ICPADM.1988.38452 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1988-09-12 |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Design for experiments Curing Temperature Epoxy resins Polynomials Regression analysis Equations Loss measurement Dielectrics and electrical insulation Encapsulation |
| Content Type | Text |
| Resource Type | Article |
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