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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Weixian Li Jingliang Li Wanfa Sheng |
| Copyright Year | 1988 |
| Description | Author affiliation: Shanghai Electr. Apparatus Res. Inst., China (Weixian Li; Jingliang Li; Wanfa Sheng) |
| Abstract | It is shown that the results of one high-temperature point from the conventional thermal aging test and the slope obtained by instrument analysis can be used to determine the thermal life line of form-wound winding insulation systems, thus leading to the determination of the temperature index and the thermal life. The conventional aging test is carried on according to IEC Pub. 611 and IEEE Std. 275. The instrument analysis makes use of two methods: gas-chromatography and thermogravimetry analysis. Six form-wound winding insulation systems have been evaluated. The results of two rapid thermal aging test methods agree fairly well with the conventional aging methods. It is noted that the proposed technique is more cost- and time-effective than the conventional thermal aging test. |
| Starting Page | 438 |
| Ending Page | 441 |
| File Size | 308929 |
| Page Count | 4 |
| File Format | |
| DOI | 10.1109/ICPADM.1988.38428 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1988-09-12 |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Aging Temperature Thermal degradation Equations Insulation testing System testing Instruments Life testing Gas insulation Materials testing |
| Content Type | Text |
| Resource Type | Article |
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