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Content Provider | IEEE Xplore Digital Library |
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Author | Makishima, S. Nakano, T. Koyama, M. Inoue, Y. |
Copyright Year | 1995 |
Description | Author affiliation: Lab. of Heavy Apparatus Eng., Toshiba Corp., Tokyo, Japan (Makishima, S.; Nakano, T.; Koyama, M.; Inoue, Y.) |
Abstract | Epoxy casting resin is used in heavy apparatus as insulation and structural material. To optimize epoxy casting processes, several analytic techniques are used. Different from other techniques, dielectric analysis (DEA) has the advantage of nondestructive and on-line process measurement. We tried to evaluate the cure profile of bis-phenol A type liquid epoxy casting resin with DEA, DSC and a viscometer simultaneously, and found that the ionic conduction portions of the loss factor correlated well with glass transition temperature and viscosity. |
Starting Page | 565 |
Ending Page | 569 |
File Size | 413628 |
Page Count | 5 |
File Format | |
ISBN | 0941783154 |
DOI | 10.1109/EEIC.1995.482494 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 1995-09-18 |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Curing Epoxy resins Casting Data envelopment analysis Dielectrics and electrical insulation Dielectric materials Dielectric measurements Glass Temperature Viscosity |
Content Type | Text |
Resource Type | Article |
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