NDLI: Thermal analysis and verification of a mounted monolithic integrated circuit

Content Provider	IEEE Xplore Digital Library
Author	Harris, T.R. Melamed, S. Luniya, S. Davis, W.R. Steer, M.B. Doxsee, L.E. Obermiller, K. Hawkinson, C.
Copyright Year	2010
Description	Author affiliation: Electrical and Computer Engineering Dept, North Carolina State University, Raleigh, NC, USA (Harris, T.R.; Melamed, S.; Luniya, S.; Davis, W.R.; Steer, M.B.) \|\| Parametric Technology Corporation Needham, MA, USA (Doxsee, L.E.; Obermiller, K.; Hawkinson, C.)
Abstract	As circuit density increases and high-power applications are facilitated, thermal considerations become paramount a design concern. In this paper, a high power monolithic microwave integrated circuit (MMIC) is modeled by the fREEDA multi-physics simulator and measured for validation. While validation is the crux of any simulation model, it is known that thermal measurements accurate to a high resolution are problematic. As such, the thermal profile of integrated circuits cannot be measured directly with infrared thermal imaging due to unequivalent emissivities of materials. It becomes necessary to use an absorptive ink to approximate a blackbody so that the infrared emissions can be used to infer temperature. The impact and effect of this thermal imaging technique is investigated in this work by comparing measurements with detailed thermal simulations with and without the surface treatment. Thermal analysis uses the finite element method and a reduced-order model based on cuboids with effective thermal conductivities. The end goal is to provide a simulation tool to designers, which can be extended to any project which requires attention to thermal preference.
Starting Page	37
Ending Page	40
File Size	1664481
Page Count	4
File Format	PDF
ISBN	9781424458547
e-ISBN	9781424458530
DOI	10.1109/SECON.2010.5453924
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-03-18
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Monolithic integrated circuits Integrated circuit measurements Thermal conductivity Integrated circuit modeling MMICs Circuit simulation Optical imaging Microwave integrated circuits Power measurement Microwave measurements fREEDA MMIC electrothermal heat transfer simulators compact modeling
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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