NDLI: Multilayer thin film cooling devices (non-reviewed)

Content Provider	IEEE Xplore Digital Library
Author	Xiao, Z.
Copyright Year	2008
Description	Author affiliation: Alabama A&M Univ., Normal (Xiao, Z.)
Abstract	Solid state thermoelectric cooling devices have been of current interest for hot-spot thermal management. Cooling hot-spots with high heat flux is becoming one of the most important technical challenges facing today's IC industry. The rising temperature limits device minimization and decreases its lifetime. The thermoelectric effect is the appearance of an electric field along a temperature gradient established in a material. The inverse effect, called the Peltier effect, can be used for refrigeration, which uses electricity to pump heat from the cold end to the hot end. In this paper, we report to fabricate an in-plan solid-state thermoelectric cooling device using multilayered $Bi_{2}Te_{3}/Sb_{2}Te_{3}$ and $Bi_{2}Te_{3}/Bi_{2}Te_{3-x}Se_{x}$ thin films. A solid-state in-plan thin film cooling device has been fabricated using multilayered thermoelectric thin films. $Bi_{2}Te_{3}/Sb_{2}Te_{3}$ and $Bi_{2}Te_{3}/Bi_{2}Te_{3-x}Se_{x}$ multilayer thin films were deposited using e-beam evaporation. Solid antimony (III) telluride and bismuth (III) telluride were evaporated to grow the $Bi_{2}Te_{3}$ and $Sb_{2}Te_{3}$ layers for the $Bi_{2}Te_{3}/Sb_{2}Te_{3}$ multilayer films. Bi, Te, and Se powders were mixed with the ratio of 2:2.7:0.3 and were heated at 700degC under nitrogen and melted into solid $Bi_{2}Te_{3-x}Se_{x}.$ The thermally-grown solid $Bi_{2}Te_{3-x}Se_{x}$ was then evaporated to grow the $Bi_{2}Te_{3-x}Se_{x}$ layer for the $Bi_{2}Te_{3}/Bi_{2}Te_{3-x}Se_{x}$ multilayer thin film together with the $Bi_{2}Te_{3}$ layer using e-beam evaporation. The $Bi_{2}Te_{3}/Sb_{2}Te_{3}$ and $Bi_{2}Te_{3}/Bi_{2}Te_{3-x}Se_{x}$ multilayer thin films have a periodic structure consisting of alternating $Bi_{2}Te_{3}$ and $Sb_{2}Te_{3}$ layers or $Bi_{2}Te_{3}$ and $Bi_{2}Te_{3-x}Se_{x}$ layers, where each layer is about 10 nm thick. The films were analyzed by XRD, SEM, and AFM. The e-beam-grown $Bi_{2}Te_{3}/Sb_{2}Te_{3}$ multilayered thin film has a resistivity of $7.1times10^{-4}$ Omegaldrcm and an in-plan Seebeck coefficient of 110 muV/K, and the e-beam-grown $Bi_{2}Te_{3}/Bi_{2}Te_{3-x}Se_{x}$ multilayered thin film has a resistivity of $1.6times10^{-4}$ Omegaldrcm and an in-plan Seebeck coefficient of -95 muV/K. An in-plan cooling device was fabricated with the $Bi_{2}Te_{3}/Sb_{2}Te_{3}$ and $Bi_{2}Te_{3}/Bi_{2}Te_{3-x}Se_{x}$ films using the standard integrated circuit (IC) fabrication process; the cooling device is consisted of 2080 pairs of p-type and n-type elements, where each element is 200 mum long and 50 mum wide; pn junction diodes were fabricated as thermometers for the measurement of temperature difference between the two ends of device. Temperature difference was achieved between the hot and cold ends under an applied DC current. The developed in-plan cooling device can be a good candidate for the application of highly-efficient micro- cooling.
Starting Page	82
Ending Page	82
File Size	284312
Page Count	1
File Format	PDF
ISBN	9781424418831
DOI	10.1109/SECON.2008.4494262
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-04-03
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Nonhomogeneous media Thin film devices Cooling Tellurium Bismuth Thermoelectricity Solid state circuits Thermoelectric devices Temperature Thermal management
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Robust thin film thermoelectric devices

Optimized thermoelectrics for energy harvesting applications

A further comparison of solid-state thermionic and thermoelectric refrigeration

Thermoelectric MEMS coolers

Synthesis and evaluation of thermoelectric multilayer films

Thick-film thermoelectric microdevices

Mini-Contact Enhanced Thermoelectric Cooling of Hot Spots in High Power Devices

Thermal management of a medical device using thermoelectric coolers

Overview of Solid-State Thermoelectric Refrigerators and Possible Applications to On-Chip Thermal Management

Multilayer thin film cooling devices (non-reviewed)

Similar Documents

Robust thin film thermoelectric devices

Optimized thermoelectrics for energy harvesting applications

A further comparison of solid-state thermionic and thermoelectric refrigeration

Thermoelectric MEMS coolers

Synthesis and evaluation of thermoelectric multilayer films

Thick-film thermoelectric microdevices

Mini-Contact Enhanced Thermoelectric Cooling of Hot Spots in High Power Devices

Thermal management of a medical device using thermoelectric coolers

Overview of Solid-State Thermoelectric Refrigerators and Possible Applications to On-Chip Thermal Management

Multilayer thin film cooling devices (non-reviewed)