NDLI: Propagation of electrical tree growth in a composite solid insulation consisted of epoxy resin and mica sheets: Simulation with the aid of Cellular Automata

Content Provider	IEEE Xplore Digital Library
Author	Christantoni, D.D. Vardakis, G.E. Danikas, M.G.
Copyright Year	2010
Description	Author affiliation: Democritus University of Thrace, Department of Electrical and Computer Engineering, Power Systems, Laboratory, 67100 Xanthi, Greece (Christantoni, D.D.; Vardakis, G.E.; Danikas, M.G.)
Abstract	Electrical treeing is one of the principal factors affecting the insulating capability of solid insulation. Epoxy resin with mica sheets is used in machine insulation. In the present paper, a point-plane electrode arrangement was used in order to simulate the electrical tree propagation in such an insulating system. The mica sheets investigated were of comparable thickness with the epoxy resin. The simulation was performed with the aid of Cellular Automata (CA). Laplace equation has been solved setting appropriate boundary conditions at the interfaces between epoxy resin — mica sheet and epoxy resin — electrodes. The simulations were based on the local field variation, the local dielectric strength and also on the variation (even slight) of the dielectric constant of the insulating materials. Such local variations of the dielectric constants render possible local variations of the electrical field and, consequently, of the tree propagation. Mica sheets as barriers inside the main insulating material preventing the electrical tree growth. The thickness of mica sheets plays an important role in the propagation of trees. The simulations indicate that even in the case of a partial penetration of the mica sheets, no complete breakdown results. The applied voltage level plays also a crucial role in the resulting type of electrical tree. Higher applied voltages result in a bush-type tree, whereas lower applied voltages result in more pointed trees. The simulation results agree with experimental data.
Starting Page	1
Ending Page	4
File Size	134705
Page Count	4
File Format	PDF
ISBN	9781424479450
e-ISBN	9781424479443
e-ISBN	9781424479436
DOI	10.1109/ICSD.2010.5568239
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-07-04
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Epoxy resins Automata Dielectric breakdown Electrodes Solids Dielectrics
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in