NDLI: Effects of addition of nano-scale alumina and silica fillers on thermal conductivity and dielectric strength of epoxy / alumina microcomposites

Content Provider	IEEE Xplore Digital Library
Author	Okazaki, Y. Kozako, M. Hikita, M. Tanaka, T.
Copyright Year	2010
Description	Author affiliation: Department of Electrical Engineering and Electronics, Faculty of Engineering, Kyushu Institute of Technology, 1-1 Sensui-cho, Kitakyushu-shi, Fukuoka, Japan (Okazaki, Y.; Kozako, M.; Hikita, M.) \|\| IPS Research Center, Waseda University, 2-2 Hibikino, Wakamatsu-ku, Kitakyushu-shi, Japan (Tanaka, T.)
Abstract	The aim of this study is to improve both thermal conductivity and electrical insulation properties of epoxy based composites using nanocomposite techniques. This paper deals with the effects of adding nano-scale alumina and silica fillers on thermal conductivity and dielectric strength of epoxy/alumina micro-composites. Two kinds of specimens were prepared with containing nano-fillers as a nanocomposite or a nano/micro composite. Also, two kinds of specimens without fillers or with 30 vol % of micro-scale alumina fillers as base materials. Average particle sizes of the alumina and silica nano-fillers used were 14 nm and 12 nm, respectively. The micro-fillers used were alumina particle of spherical shape, and its average particle size was about 10 µm. Nano-filler content was 5 wt % in each specimen. Thermal conductivity was evaluated by the laser flash method. AC dielectric strength was measured by a sphere-plane electrode system immersed in insulating liquid. Cracked surfaces were observed with the scanning electron microscope to check the state of nano-fillers dispersion. It was elucidated that an improvement effect of each nano-filler addition is seen on both thermal conductivity and dielectric strength.
Starting Page	1
Ending Page	4
File Size	1207468
Page Count	4
File Format	PDF
ISBN	9781424479450
e-ISBN	9781424479443
e-ISBN	9781424479436
DOI	10.1109/ICSD.2010.5568057
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-07-04
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Dielectrics Solids silica filler epoxy nano-composites metal-base printed wiring board thermal conductivity dielectric strength alumina filler
Content Type	Text
Resource Type	Article

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