NDLI: Thermal solution development for high-end server systems

Content Provider	IEEE Xplore Digital Library
Author	Guoping Xu Follmer, L.
Copyright Year	2005
Description	Author affiliation: Sun Microsystems, Inc, San Diego, CA, USA (Guoping Xu; Follmer, L.)
Abstract	A methodology to develop a thermal solution was demonstrated through a case study of upgrading processors in an existing cabinet, thereby increasing the power envelope of the processors. The Sun Fire E25K server, based on UltraSparc IV (USIV), was used as an example in this paper. This high-end server utilized the same physical configuration as in the preceding generation Sun Fire 15K server accommodating seventy-two UltraSparc III (USIII) processors. Extensive experimental investigations have been carried out to characterize the thermal performance in the Sun Fire 15K including cabinet-level, board-level, CPU air-cooled heat sink, and fan/fan tray thermal characterization. Solutions were proposed by combining the experimental data with flow network modeling, validated analytical methods and numerical modeling. Solutions included a new CPU heat sink design and air flow optimization at the board and cabinet level. The proposed solutions were verified in the existing product and successfully implemented in the new product.
Starting Page	109
Ending Page	115
File Size	743734
Page Count	7
File Format	PDF
ISBN	0780389859
ISSN	10652221
DOI	10.1109/STHERM.2005.1412166
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-03-15
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Heat sinks Sun Fires Electronics cooling Design optimization Product development Power supplies Network servers Analytical models Numerical models
Content Type	Text
Resource Type	Article

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