NDLI: Extending the heat flux limit with enhanced microchannels in direct single-phase cooling of computer chips

Content Provider	IEEE Xplore Digital Library
Author	Kandlikar, S.G. Upadhye, H.R.
Copyright Year	2005
Description	Author affiliation: Mech. Eng. Dept., Rochester Inst. of Technol., NY, USA (Kandlikar, S.G.; Upadhye, H.R.)
Abstract	The high heat transfer coefficients in microchannels are attractive for direct cooling of computer chips requiring high heat-flux removal. However, this is associated with a severe pressure drop penalty. Channel size optimization therefore becomes necessary in selecting an appropriate channel geometry configuration. As the heat flux increases beyond about 2 MW/m/sup 2/, the heat transfer and pressure drop characteristics of the plain channels dictate the use of turbulent flow through the channels, which suffers from an excessive pressure drop penalty. It therefore becomes essential to incorporate enhancement features in the microchannels and multiple passes with shorter flow lengths to provide the desired solution. Results obtained from a theoretical analysis are presented as parametric plots for the heat transfer and pressure drop performance of a 10 mm/spl times/10 mm silicon chip incorporating plain microchannels. Enhanced microchannels with offset strip fins in single-pass and split-flow arrangements are also investigated. The results show that the enhanced structures are capable of dissipating heat fluxes extending beyond 3 MW/m/sup 2/ using water as the coolant in a split-flow arrangement with a core pressure drop of around 35 kPa.
Starting Page	8
Ending Page	15
File Size	660642
Page Count	8
File Format	PDF
ISBN	0780389859
ISSN	10652221
DOI	10.1109/STHERM.2005.1412152
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-03-15
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microchannel Cooling Heat transfer Water heating Heat sinks Temperature Thermal conductivity Thermal factors Heat engines Geometry
Content Type	Text
Resource Type	Article

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