NDLI: Thermal impact of solder voids in the electronic packaging of power devices

Content Provider	IEEE Xplore Digital Library
Author	Zhu, N.
Copyright Year	1999
Description	Author affiliation: Lasertron Inc., Bedford, MA, USA (Zhu, N.)
Abstract	The subject of this paper is the thermal impact of solder voids in the electronic packaging of semiconductor power devices. First, the pros and cons of some conventional methods used in thermal analysis are assessed, with emphasis on the accuracy of the commonly-used 45/spl deg/ model in calculating thermal resistance. Finite element thermal analysis is then applied to the case of different solder voids, which are classified and modeled numerically. The thermal resistance for each case is calculated and compared. It is found that different kinds of solder voids have a quite different impact upon the overall package thermal impedance. Large, coalesced voids have a more significant effect than small, distributed voids. The influence of solder voids on the example of a semiconductor laser chip is also analyzed. It is found that the long strip-type heat generating areas/volumes associated with semiconductor laser chips result in a strong sensitivity to the orientation of solder voids underneath. Finally, solder joint inspection criteria outlined in MIL-STD-883D method 2030 are discussed. Some possible modifications are proposed for the inspection of solder joints in semiconductor laser chip bonding.
Starting Page	22
Ending Page	29
File Size	658408
Page Count	8
File Format	PDF
ISBN	0780352645
ISSN	10652221
DOI	10.1109/STHERM.1999.762424
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-03-09
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronic packaging thermal management Electronics packaging Thermal resistance Semiconductor lasers Soldering Inspection Finite element methods Numerical models Semiconductor device packaging Impedance
Content Type	Text
Resource Type	Article

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