NDLI: Optimizing cost and thermal performance: rapid prototyping of a high pin count cavity-up enhanced plastic ball grid array (EPBGA) package

Content Provider	IEEE Xplore Digital Library
Author	Zahn, B.A.
Copyright Year	1999
Description	Author affiliation: Package Characterization Lab., ChipPAC Inc., Chandler, AZ, USA (Zahn, B.A.)
Abstract	A three-dimensional finite element model of a 420 lead (5 row perimeter) cavity-up enhanced plastic ball grid array (EPBGA) package was developed using the ANSYS/sup TM/ finite element simulation code. The developed model was utilized to perform a sensitivity analysis in order to quantify the effects of varying package and system motherboard designs. Design variables included: (1) chip size; (2) package substrate metallized plane layers; (3) motherboard metallized plane layers; (4) inner solder ball matrix and vias; (5) package aluminum heat spreader thickness; and (6) chip power dissipation. Predicted package junction-to-ambient thermal resistance (/spl theta//sub JA/) values were used in conjunction with a central composite design of experiments to develop a response surface equation which quickly predicts EPBGA package thermal performance as a function of the six design variables. The methodology described allows for rapid analysis of design options in the "dynamic" environment of prototyping, and the implementation of optimized cost effective package designs to meet required standards under multiple customer environments.
Starting Page	133
Ending Page	141
File Size	734181
Page Count	9
File Format	PDF
ISBN	0780352645
ISSN	10652221
DOI	10.1109/STHERM.1999.762440
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-03-09
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Cost function Prototypes Thermal resistance Finite element methods Metallization Surface resistance Lead Electronics packaging Plastic packaging Sensitivity analysis
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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