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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Liimatainen, V. Kharboutly, M. Rostoucher, D. Gauthier, M. Quan Zhou |
| Copyright Year | 2013 |
| Description | Author affiliation: AS2M Dept., FEMTO-ST Inst., Besancon, France (Kharboutly, M.; Rostoucher, D.; Gauthier, M.) || Dept. of Autom. & Syst. Technol., Aalto Univ., Espoo, Finland (Liimatainen, V.; Quan Zhou) |
| Abstract | Ultra-thin dies are difficult to package because of their fragility and flexibility. Current ultra-thin die integration technology for 3D microsystems relies on robotic pick-and-place machines and machine vision, which has rather limited throughput for high-accuracy assembly of fragile ultra-thin dies. In this paper, we report a hybrid assembly strategy that consists of robotic pick-and-place using a vacuum micro-gripper, and droplet self-alignment by capillary force. Ultra-thin dies with breakable links are chosen as part of the assembly strategy. Experimental results show that we can align ultra-thin (10μm) dies with sub-micron accuracy without machine vision. A fully automatic sequence of stacking several of these dies is demonstrated. Up to 12 ultra-thin dies have been stacked. These early results show that die-to-die integration of ultra-thin dies with higher throughput than the current industry robot is possible by applying both robotic handling and droplet self-alignment to ultra-thin die assembly. |
| Starting Page | 1403 |
| Ending Page | 1408 |
| File Size | 1221610 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781467356411 |
| ISSN | 10504729 |
| e-ISBN | 9781467356435 |
| DOI | 10.1109/ICRA.2013.6630754 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-05-06 |
| Publisher Place | Germany |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Force Accuracy Grippers Stacking Robots Assembly Throughput |
| Content Type | Text |
| Resource Type | Article |
| Subject | Artificial Intelligence Control and Systems Engineering Electrical and Electronic Engineering Software |
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