NDLI: Cost effective small via generation-the laser solution

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Proceedings 1997 IEEE Multi-Chip Module Conference

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)

Economics modelling for the determination of optimal known good die strategies

A physics-of-failure (POF) approach to addressing device reliability in accelerated testing of MCMs

Fault isolation and performance characterization of high speed digital multichip modules

An MCM-D memory module in an overmolded plastic package

The design and implementation of NASA's advanced flight computing module

A silicon-on-silicon MCM for voice recognition/telephone answering device

Field programmable multi-chip module (FPMCM)-an integration of FPGA and MCM technology

A novel 2-sided multi-chip-module used to create a 50,000 gate programmable logic device

Design considerations for implementing a modularly configured attached processor in a multi chip module

Electrical and thermal study of membrane multi-chip module systems

Thermosonic bonding for flip-chip assembly

Inductance calculations for MCM system design and simulation

Sensitivity analysis of interconnect networks based on S-parameter macromodel

Electromagnetic modeling and transient simulation of interconnects in high speed VLSI

An automatic network generator for design verification of electronic packages

Two-pole analysis of interconnection trees

Avoiding dispersion in distributed RLC lines by shaping

Comparisons of bus transfer operations using PPS (pulsed power supply) and conventional CMOS in PWB and MCM environments

Wire width optimization of transmission lines for low power design

Design of mixed signal MCM-Ds using silicon circuit boards

System design optimization for MCM

Impact of packaging technology on system partitioning: a case study

Efficient modeling and simulation of coupled transmission lines

Moment models of general transmission lines with application to MCM interconnect analysis

Optimal transient simulation of distributed lines

A novel low cost MCM-D technology

Design and characterization of three-dimensional aluminum nitride multichip modules

Efficient smart substrates with test capabilities and on-line temperature monitoring

Micro heat spreader enhanced heat transfer in MCMs

Application of capacitive coupling to switch fabrics

A low-cost MCM design topology-the interconnected mesh power system (IMPS)

High temperature Cu-Sn joints manufactured by a 250/spl deg/C fluxless bonding process

Cost effective small via generation-the laser solution

Experimental characterization of simultaneous switching noise for multichip module

A unified approach to chip, test, and assembly technologies for MCMs

Examination of high frequency dielectric properties of thin film polymers using an in-situ resonant technique

Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92

Cost effective small via generation-the laser solution

Content Provider	IEEE Xplore Digital Library
Author	Bo Gu Morrison, J.M.
Copyright Year	1995
Description	Author affiliation: Lumonics Inc., Kanata, Ont., Canada (Bo Gu; Morrison, J.M.)
Abstract	In today's electronics packaging industry, the choice of the technologies of generating smaller vias remains undetermined. Laser drilling is one of the most promising among all small via generation technologies. However, historically laser processing has been viewed as an expensive and slow process. We recently reported a cost effective small via drilling process based on a modified TEA CO/sub 2/ laser. The field test showed the process was reliable and cost effective. The new results from more in-depth experiments are presented in this paper along with the comparison among various laser drilling technologies.
Starting Page	212
Ending Page	216
File Size	714828
Page Count	5
File Format	PDF
ISBN	0818669705
DOI	10.1109/MCMC.1995.512029
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-01-31
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Costs Drilling Laser beams Laser modes Copper Etching Laser ablation Electronics packaging Surface emitting lasers Gas lasers
Content Type	Text
Resource Type	Article

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