NDLI: Design and characterization of three-dimensional aluminum nitride multichip modules

Content Provider	IEEE Xplore Digital Library
Author	Palmquist, S.L. Jensen, R.J. Jacobsen, W.F. Spielberger, R.K.
Copyright Year	1995
Description	Author affiliation: Solid State Electron. Center, Honeywell Inc., Plymouth, MN, USA (Palmquist, S.L.; Jensen, R.J.; Jacobsen, W.F.; Spielberger, R.K.)
Abstract	A three-dimensional packaging technology based on stacked multi-layer aluminum nitride (AlN) multichip modules (MCMs) has been demonstrated by Honeywell and Coors Electronic Package Company, under sponsorship of the Naval Command, Control and Ocean Surveillance Center. The concept increases chip density by stacking single-or double-sided AlN MCMs that have internal metal layers for signal interconnection and power distribution. Prototype Technology Characterization Vehicles (TCVs) have been fabricated to verify key fabrication and assembly processes, and to characterize the electrical, thermal, and mechanical performance of the 3D structures. Exceptional thermal performance has been predicted by finite element models and corroborated by experimental measurements for single and stacked MCMs. The electrical characteristics of AlN interconnections for the TCV are also discussed. A demonstration system consisting of a GVSC 1750A processor MCM and a double-sided memory MCM has been designed and fabricated. A prototype of the demonstration system is shown.
Starting Page	177
Ending Page	182
File Size	823425
Page Count	6
File Format	PDF
ISBN	0818669705
DOI	10.1109/MCMC.1995.512023
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-01-31
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Aluminum nitride Electronics packaging Marine technology Prototypes Multichip modules Oceans Surveillance Stacking Power distribution Vehicles
Content Type	Text
Resource Type	Article

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